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RFP14N06
Data Sheet July 1999 File Number
4002.3
14A, 60V, 0.100 Ohm, N-Channel Power MOSFET
This N-Channel power MOSFET is manufactured using the MegaFET process. This process which uses feature sizes approaching those of LSI integrated circuits, gives optimum utilization of silicon, resulting in outstanding performance. It was designed for use in applications such as switching regulators, switching convertors, motor drivers, and relay drivers. This transistor can be operated directly from integrated circuits. Formerly developmental type TA09770.
Features
* 14A, 60V * rDS(ON) = 0.100 * Temperature Compensating PSPICE(R) Model * Peak Current vs Pulse Width Curve * UIS Rating Curve * 175oC Operating Temperature * Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
Ordering Information
PART NUMBER RFP14N06 PACKAGE TO-220AB BRAND RFP14N06
Symbol
D
NOTE: When ordering, use the entire part number.
G
S
Packaging
TO-220AB
SOURCE DRAIN GATE DRAIN (FLANGE)
4-492
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures PSPICE(R) is a registered trademark of MicroSim Corporation. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999
RFP14N06
Absolute Maximum Ratings
TC = 25oC Unless Otherwise Specified RFP14N06 60 60 20 14 Refer to Peak Current Curve Refer to UIS Curve 48 0.32 -55 to 175 300 260 UNITS V V V A
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Linear Derating Factor Above TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg
W W/oC oC
oC oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. TJ = 25oC to 150oC.
Electrical Specifications
PARAMETER
TC = 25oC, Unless Otherwise Specified SYMBOL BVDSS VGS(TH) IDSS IGSS rDS(ON) tON td(ON) tr td(OFF) tf tOFF Qg(TOT) Qg(10) Qg(TH) CISS COSS CRSS RJC RJA TO-220AB VGS = 0V to 20V VGS = 0V to 10V VGS = 0V to 2V VDD = 48V, ID = 14A, RL = 3.42, IG(REF) = 0.4mA (Figure 13) TEST CONDITIONS ID = 250A, VGS = 0V (Figure 11) VGS = VDS, ID = 250A, (Figure 10) VDS = Rated BVDSS, VGS = 0V VDS = 0.8 x Rated BVDSS, VGS = 0V, TC = 150oC VGS = 20V ID = 14A, VGS = 10V, (Figure 9) VDD =30V, ID = 7A, RL = 4.3, VGS = 10V, RGS = 25 (Figure 13) MIN 60 2 TYP 14 26 45 17 570 185 50 MAX 4 1 25 100 0.100 60 100 40 25 1.5 3.125 62 UNITS V V A A nA ns ns ns ns ns ns nC nC nC pF pF pF
oC/W oC/W
Drain to Source Breakdown Voltage Gate Threshold Voltage Zero Gate Voltage Drain Current
Gate to Source Leakage Current Drain to Source On Resistance (Note 2) Turn-On Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-Off Time Total Gate Charge Gate Charge at 10V Threshold Gate Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient
VDS = 25V, VGS = 0V, f = 1MHz (Figure 12)
Source to Drain Diode Specifications
PARAMETER Source to Drain Diode Voltage Diode Reverse Recovery Time NOTES: 2. Pulse test: pulse width 300s, duty cycle 2%. 3. Repetitive rating: pulse width limited by maximum junction temperature. See Transient Thermal Impedance curve (Figure 3) and Peak Current Capability Curve (Figure 5). SYMBOL VSD trr ISD = 14A ISD = 14A, dISD/dt = 100A/s TEST CONDITIONS MIN TYP MAX 1.5 125 UNITS V ns
4-493
RFP14N06 Typical Performance Curves
1.2 POWER DISSIPATION MULTIPLIER 1.0 ID, DRAIN CURRENT (A) 0 25 50 75 100 125 150 175 12 0.8 0.6 0.4 0.2 0 TC , CASE TEMPERATURE (oC)
Unless Otherwise Specified
16
8
4
0
25
50
75 100 125 TC, CASE TEMPERATURE (oC)
150
175
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs CASE TEMPERATURE
1 ZJC, NORMALIZED THERMAL IMPEDANCE 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJA x RJA + TA 10-4 10-2 10-1 10-3 t, RECTANGULAR PULSE DURATION (s) 100 101 PDM
0.01 10-5
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
100
IDM, PEAK CURRENT (A)
TC = 25oC TJ = MAX RATED SINGLE PULSE
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION 100
FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS:
ID, DRAIN CURRENT (A)
10
100s
175 - T C I = I 25 --------------------- 150
1ms OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) 1
VGS = 10V VGS = 20V
TC = 25oC
10ms 100ms DC 200
1
10 100 VDS, DRAIN TO SOURCE VOLTAGE (V)
10 10-5
10-4
10-3 10-2 10-1 t, PULSE WIDTH (s)
100
101
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA
FIGURE 5. PEAK CURRENT CAPABILITY
4-494
RFP14N06 Typical Performance Curves
50 IAS, AVALANCHE CURRENT (A)
Unless Otherwise Specified (Continued)
35
VGS = 20V VGS = 8V
30 VGS = 10V ID, DRAIN CURRENT (A) STARTING TJ = 25oC 10 25 20 15
PULSE DURATION = 250s DUTY CYCLE = 0.5% MAX TC = 25oC VGS = 7V
STARTING TJ = 150oC If R = 0 tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD) 1 If R 0 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS-VDD) +1] 0.01 0.1 1 tAV, TIME IN AVALANCHE (ms) 10
VGS = 6V 10 5 0 0 6 2 4 VDS , DRAIN TO SOURCE VOLTAGE (V) 8 VGS = 5V VGS = 4.5V
NOTE: Refer to Intersil Application Notes AN9321 and AN9322 FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING FIGURE 7. SATURATION CHARACTERISTICS
IDS(ON), DRAIN TO SOURCE CURRENT (A)
35 30 25 20 15 10 5 0 0 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VDD = 15V
25oC -55oC 175oC NORMALIZED DRAIN TO SOURCE ON RESISTANCE
2.5
2.0
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VGS = 10V, ID = 14A
1.5
1.0
0.5
2 4 6 8 VGS, GATE TO SOURCE VOLTAGE (V)
10
0 -80
-40
0
40
80
120
160
200
TJ, JUNCTION TEMPERATURE (oC)
FIGURE 8. TRANSFER CHARACTERISTICS
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE
2.0 VGS = VDS, ID = 250A NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE
2.0
ID = 250A
NORMALIZED GATE THRESHOLD VOLTAGE
1.5
1.5
1.0
1.0
0.5
0.5
0 -80
-40
0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC)
200
0 -80
-40
0
40
80
120
160
200
TJ , JUNCTION TEMPERATURE (oC)
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE vs JUNCTION TEMPERATURE
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RFP14N06 Typical Performance Curves
700 CISS 600 C, CAPACITANCE (pF) 500 400 COSS 300 200 100 0 0 5 10 15 20 VDS, DRAIN TO SOURCE VOLTAGE (V) 25 CRSS VGS = 0V, f = 1MHz CISS = CGS + CGD CRSS = CGD COSS CDS + CGD VDS, DRAIN TO SOURCE VOLTAGE (V)
Unless Otherwise Specified (Continued)
60 VDD = BVDSS 45 VDD = BVDSS 7.5 10 VGS, GATE TO SOURCE VOLTAGE (V)
30 0.75 BVDSS 0.50 BVDSS 0.25 BVDSS RL = 4.28 IG(REF) = 0.4mA VGS = 10V IG(REF) IG(ACT) IG(REF) IG(ACT)
5.0
15
2.5
0 20 t, TIME (s) 80
0
NOTE: Refer to Intersil Application Notes AN7254 and AN7260. FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE FIGURE 13. NORMALIZED SWITCHING WAVEFORMS FOR CONSTANT GATE CURRENT
Test Circuits and Waveforms
VDS BVDSS L VARY tP TO OBTAIN REQUIRED PEAK IAS VGS DUT tP RG IAS VDD tP VDS VDD
+
0V
IAS 0.01
0 tAV
FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 15. UNCLAMPED ENERGY WAVEFORMS
tON VDS VDS VGS RL
+
tOFF td(OFF) tr tf 90%
td(ON)
90%
DUT RGS VGS
-
VDD
0
10% 90%
10%
VGS 0 10%
50% PULSE WIDTH
50%
FIGURE 16. SWITCHING TIME TEST CIRCUIT
FIGURE 17. RESISTIVE SWITCHING WAVEFORMS
4-496
RFP14N06 Test Circuits and Waveforms
(Continued)
VDS RL VDD VDS VGS = 20V VGS
+
Qg(TOT)
Qg(10) VDD VGS VGS = 2V 0 Qg(TH) Ig(REF) 0 VGS = 10V
DUT Ig(REF)
FIGURE 18. GATE CHARGE TEST CIRCUIT
FIGURE 19. GATE CHARGE WAVEFORM
4-497
RFP14N06 PSPICE Electrical Model
.SUBCKT RFP14N06 2 1 3 ;
CA 12 8 8.84e-10 CB 15 14 9.34e-10 CIN 6 8 5.2e-10
DPLCAP 5 LDRAIN RSCL1 RSCL2 + 51 5 51 ESCL 50 6 8 VTO 6 + 21 MOS1 RIN CIN 8 RSOURCE 7 LSOURCE 3 SOURCE RDRAIN 16 11 17 EBREAK 18 MOS2 + DBODY DBREAK
rev 9/12/94
DBODY 7 5 DBDMOD DBREAK 5 11 DBKMOD DPLCAP 10 5 DPLCAPMOD EBREAK 11 7 17 18 62.87 EDS 14 8 5 8 1 EGS 13 8 6 8 1 ESG 6 10 6 8 1 EVTO 20 6 18 8 1 IT 8 17 1
GATE
10
DRAIN 2
ESG + EVTO + 18 8
-
LDRAIN 2 5 1e-9 LGATE 1 9 4.34e-9 LSOURCE 3 7 3.79e-9 MOS1 16 6 8 8 MOSMOD M = 0.99 MOS2 16 21 8 8 MOSMOD M = 0.01 RBREAK 17 18 RBKMOD 1 RDRAIN 50 16 RDSMOD 2.2e-3 RGATE 9 20 5.64 RIN 6 8 1e9 RSCL1 5 51 RSCLMOD 1e-6 RSCL2 5 50 1e3 RSOURCE 8 7 RDSMOD 42.3e-3 RVTO 18 19 RVTOMOD 1 S1A S1B S2A S2B 6 12 13 8 S1AMOD 13 12 13 8 S1BMOD 6 15 14 13 S2AMOD 13 15 14 13 S2BMOD
1 LGATE
9
20
-
RGATE
S1A 12 13 8 S1B CA EGS +
S2A 14 13 S2B 13 CB 6 8 + EDS 5 8 14 IT 15 17 RBREAK 18 RVTO 19 VBAT +
-
-
VBAT 8 19 DC 1 VTO 21 6 0.82 ESCL 51 50 VALUE = {(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)*1e6/50,6))} .MODEL DBDMOD D (IS = 1.5e-13 RS = 10.9e-3 TRS1 = 2.3e-3 TRS2 = -1.75e-5 CJO = 6.84e-10 TT = 4.2e-8) .MODEL DBKMOD D (RS = 4.15e-1 TRS1 = 3.73e-3 TRS2 = -3.21e-5) .MODEL DPLCAPMOD D (CJO = 26.2e-11 IS = 1e-30 N = 10) .MODEL MOSMOD NMOS (VTO = 3.91 KP = 12.68 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u) .MODEL RBKMOD RES (TC1 = 7.73e-4 TC2 = 2.12e-6) .MODEL RDSMOD RES (TC1 = 5.0e-3 TC2 = 2.53e-5) .MODEL RSCLMOD RES (TC1 = 2.05e-3 TC2 = 1.35e-5) .MODEL RVTOMOD RES (TC1 = -4.44e-3 TC2 = -6.45e-6) .MODEL S1AMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -5.29 VOFF= -3.29) .MODEL S1BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -3.29 VOFF= -5.29) .MODEL S2AMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -2.25 VOFF= 2.75) .MODEL S2BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = 2.75 VOFF= -2.25) .ENDS NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature Options; written by William J. Hepp and C. Frank Wheatley.
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RFP14N06
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